LEAPER Visual Inspection Solutions for Laser
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LEAPER Visual Inspection Solutions for Laser

Vision algorithms and optical solutions for the laser industry. In-depth focus on visual applications in visual positioning and post-welding visual inspection in the laser industry.

LPVL
Laser Galvanometer Control Algorithm Module
  • LPVL is a visual algorithm software developed based on LPV, which can be applied to laser galvanometer control and servo control.

  • LPVC
    Contour Recognition Algorithm Module
  • LPVC is based on the secondary development of LPV and is used to identify the contour features of the target product.

  • LPL
    General Laser Precision Machining Software
  • LPL is developed based on LPV and guided configuration interaction design concepts, and completes task configuration in 4 steps.

  • MPP
    Laser Marking Vision System
  • MPP (Manually Position Processing)  laser marking vision system contains hardware and algorithmic software modules, including camera imaging control module, galvanometer BOX correction module, camera distortion and tilt correction module, calibration module, ROI presetting and cropping module, Visual based height adjustment module, etc. It can be split and integrated according to users' needs, which is convenient for users to develop efficiently, and realize operation with high precise  for laser marking.
    • Camera Pixels (standard): 8MP
    • Installation Height: 250mm~300mm
    • Effective Capture Range: ≥160mm*160mm
    • Single Pixel Accuracy: ≤ 0.1mm
    • Data Interface: USB2.0

    Laser Industry Applications

    Automotive
    Flat Wire Motor Laser Welding
    • Inspection Content: Defects such as misalignment, angle, clearance, etc.
    • Static Repetitive Positioning Accuracy: ≤ 0.5pixels
    • Overall Processing Positional Accuracy: ≤ 15μm
    • Overall Processing Yield Rate: ≥ 99.5%
    • Visual One-shot Positioning Beats: ≤ 200ms (Without Processing)
    • Total Beats (Vision + Welding): ≤ 35s

    Li-ion Battery
    Cover Plate Assembly Laser Welding
    • Static Repetitive Positioning Precision: ≤ 0.5pixels
    • Overall Processing Positional Accuracy: ≤ 15μm
    • Overall Processing Yield Rate: ≥ 99.5%
    • Visual One-shot Positioning Beats: ≤ 200ms (Without Processing)
    • Visual IPC Configuration: I5-6200U, 8G
    • Overall Laser Processing Cycle: Cathode & Anode<1.8s, Explosion-proof Valve<2.5s, Battery contacts<1.2s

    Li-ion Battery
    Sealing Nail Laser Welding
    • Inspection Content: Defects such as pinholes, partial welding, broken welding, fmissed welding, warped nails, no nails, etc.
    • Detection Accuracy: 0.2mm
    • Visual Detection Range: ≤ 9mm
    • Overkill Rate: ≤ 1.0%
    • Omission Ratio: 0
    • Equipment Beats: ≤ 6.3PPM
    • Visual Beats: ≤ 1.5s/PCS

    Semiconductor
    IC Chip Laser Marking
    • Frame Width: ≥ 135mm
    • Product Size: ≤ 320mm*135mm
    • Chip Size: Minimum 3mm*3mm, Maximum 65mm*65mm
    • Image Acquisition Time: ≤ 3s
    • Image Processing Time: ≤ 30ms / Single Chip
    • Visual Positioning Accuracy: ≤ ±0.02mm

    3C Electronics
    Acoustic Engine Laser Welding
    • Difficulties : Coaxial laser processing imaging system has poor image quality, few positioning features and serious interference.
    • Solution : Algorithms such as linear caliper, blob, kerf, etc., the positioning robustness is better than conventional linear positioning.
    • Overall Accuracy: ≤ 20μm
    • Static Repeatability: ≤ 0.5pixels
    • Dynamic Repeatability: ≤ 3pixles

    Solar Photovoltaic
    PV Module Junction Box Laser Welding
    • Inspection Content : Defects such as bursting point, partial welding, insufficient welding wire, etc.
    • FOV : ≥ 60mm*40mm
    • XY Positioning Accuracy : ≤ ±0.15mm
    • Visual Positioning : ≥ 99.8%
    • False Positive Rate after Welding : ≤ 0.5%
    • Omission Ratio after Welding : 0