Hangzhou Leaper Technology Co., Ltd.

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Leaper WaferScan Toolkit

Leaper WaferScan Toolkit (LPW: Main Page (intelliblink.com)) is designed to help user build the widest range of machine vision applications with ultimate flexibility. LPW allows developers to write their own vision processing, configure multi-threading, and access all tool properties and options. Cost-effective, high-quality production of semiconductors and LEDs require speed, accuracy and frictionless tracking through the whole fabrication. Semiconductor manufacturers and OEMs rely on LEAPER machine vision technology to ensure precise alignment of wafers during sorting, counting, masking and etching processes, increase traceability of wafers and die as they move through the front and back-end processes, and improve product quality through advanced inspection procedures.

Product

Leaper Vision Toolkit

Leaper WaferScan Toolkit Visual Inspection Process

AOI Position Inspection

IInspection Requirements: Identification and positioning of LED components.
Detection Accuracy: XY offset ≤ ± 40μm, angular deflection ≤ ± 9°
Detection Speed: 60s /90,000 PCS
Detection Solution: Realize the positioning of bounding pads and chips through template matching and image processing.

Circuit Probert

Inspection Requirements: Positioning of LED chips, forming a map of the wafer, and marking.
Detection Accuracy: < 0.2 pixels
Detection Speed: 70ms / 400 PCS / 6MP, 180ms / 4500 PCS / 1.5MP
Detection Solution: Realize high-speed and accurate die positioning during wafer scanning, and remove twins and bad dies based on die arrangement, as well as generate waferMap in real time according to die coordinates and data.

Wire Bonding Position Inspection

Inspection Requirements: Accurately locate the pad to achieve wire bonding between the lead and pad.
Detection Accuracy: 2pixels
Detection Speed: 8ms
Detection Solution: Template matching based on shape and machine learning to realize pad positioning in environments with uneven pad imaging quality and large background interference.

Wafer Dicing Kerf Inspection
(1) Wafer Sawing

Detection Accuracy: 0.5pixels
Detection Speed: 120ms
Inspection Solution: template matching algorithm to locate the packaged chip, Kerf algorithm to detect the position and width of the dicing line, geometric algorithm to detect the size of the lead and pad of the packaged chip, and AOI algorithm to locate the defects of the lead and pad.

Wafer Dicing Kerf Inspection
(2) Laser Dicer

Detection Accuracy: 1μm
Detection Speed: 20ms
Detection Solution: Kerf algorithm realizes the center position positioning of the dicing line and the measurement of the dicing line size. Double edge detection can be used in the scene with large interference.

LED Mapping Sorter

Inspection Requirements: Accurately provide chip positions, detect and eliminate chip defects, such as twins, notch, dirt, large angle deviations, etc.
Detection Accuracy: 0.3pixels, angle < 1°
Detection Speed: 100-300ms
Detection Solution: Use template matching to locate the chips in the wafer, image preprocessing and Blob to filter abnormal chip data, then sort the remains and provide them to the equipment pick up.

IC Tester

Inspection Requirements: For the precise positioning of chips in complex backgrounds.
Detection Accuracy: 0.3pixels
Detection Speed: 30ms
Detection Solution: Template matching realizes the positioning of the IC chip, the gauge realizes the wafer edge inspection, and the blob realizes the needle mark detection.

Dicer Kerf Inspection

Inspection Requirements: Wafer cutting line position, size and chipping inspection.
Detection Accuracy: 1μm
Detection Speed: 20ms
Detection Solution: Kerf algorithm realizes the positioning and measurement of the cutting line. Double-edge detection scheme can be used in scenes with large interference.

Dicer Bandgap Inspection

Inspection Requirement: Dicing line inspection for Mini LED chips, and also used for most conventional LED chips.
Detection Accuracy: 0.5pixels
Detection Speed: 40ms
Detection Solution: Kerf algorithm realizes crack gap detection before and after the dicing, judges whether the wafer is completely fractured, and then adjusts the cutting depth.

Defect Detection of LED Rework Equipment

Inspection Requirements: Identify and position pads and chips.
Detection Accuracy: 2pixels
Detection Speed: 300ms
Detection Solution: Image preprocessing, template matching and array sorting to realize pad positioning, search for internal LED die position and quality based on pad position.