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Equipment Name
Post-FC DB IR Inspection System
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Equipment Model
LPDBI-112
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Applicable Chip Types
≤ 35mil
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Chip Surface Defect Inspection
Die Chipping, Die Crack, Die Shift, Die Size, Contamination, Die Bevel Defect, Missing Component
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Chip Internal Defect Inspection
Micro Crack, Die Chipping, Die Crack
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Machine Configuration
Standalone System
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Dimensions (W×D×H)
1180mm×1100mm×1820mm (Without Three-Color Tower Light)
1180mm×1100mm×2295mm (With Three-Color Tower Light)
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Weight
900kg
