Lead Scan Semiconductors
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Top 2D Vision Module

Performs top-side OCR recognition on IC products and detects surface defects, such as scratches, dents, dirt, and damage.
Defect Images

Technical Parameters


  • FOV
    52mm × 52 mm
  • XY Lateral Resolution
    10 μm
  • Pixels Per FOV
    5120 × 5120
  • Min Defect
    20 μm
  • Min Character Stroke Width
    40 μm
  • Min Character Height
    0.23 mm
  • Minimum grey value difference
    30
  • L × W × H
    254mm × 254mm × 462mm
  • Weight
    ≈ 15 kg