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Die Bonding AOI Semiconductors
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Semicon-DB AOI

High-Speed Die Micro-crack Inspection System

Defect Images

Technical Parameters


  • Equipment Name
    High-Speed Die Micro-crack Inspection System
  • Equipment Model
    LPDBI-011
  • Applicable Chip Types
    ≤ 3mil（IPD）
  • Chip Surface Defect Inspection
    Micro Crack, Die Chipping, Die Crack
  • Machine Configuration
    Standalone System
  • Dimensions (W×D×H)
    650mm×1000mm×1650mm (Without Three-Color Tower Light)
    650mm×1000mm×1916mm (With Three-Color Tower Light)
  • Weight
    650kg