Lead Scan Semiconductors
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Tape & Reel Vision Module

Detects defects such as missing components in pockets, cover tape misalignment, surface damage, and scratches before and after Tape & Reel. Measures heat seal width and carrier tape hole dimensions, and determines product orientation and heat seal position.
Defect Images

Technical Parameters


  • FOV
    60mm × 48mm
  • Pixels Per FOV
    1280 × 1024
  • Resolution
    0.048 mm/pixel