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Die Bonding AOI Semiconductors
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Semicon-DB AOI

Die Micro-crack Inspection Module

Defect Images

Technical Parameters


  • Equipment Name
    Die Micro-crack Inspection Module
  • Equipment Model
    LPDBI-010
  • Applicable Chip Types
    FCCSP/FCBGA
  • Chip Surface Defect Inspection
    Micro Crack, Die Chipping, Die Crack
  • Machine Configuration
    Retrofit Module
  • Dimensions (W×D×H)
    1050mm×1000mm×1110mm (Without Three-Color Tower Light)
    1050mm×1000mm×1410mm (With Three-Color Tower Light)
  • Weight
    150kg