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Lead Scan
Semiconductors
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Semicon-Lead Scan
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PIC
Semicon-Lead Scan
Film
Planar Materials
Sheet Sorting Machine
RTS-AOI Sorter
RTP- Pre/Post-Offset Tester
Photovoltaic
Micro Crack
PECVD
PL
PE&PL
Cassette
Graphite Boat
Screen Printing
SE
Quartz boat inspection
Debris
Watermark
Final Product Sorting
Semiconductor
Semicon-DB AOI
Post-FC DB IR Inspection System
High-Speed Die Micro-crack Inspection System
Die Micro-crack Inspection Module
Semicon-Lead Scan
Bottom 2D/3D
Top 2D
Top 3D
4 Sides
PIC
Tape & Reel
IR
AI
Li-ion Battery
Laser
Logistics
PIC Vision Module
Detects missing, stacked, or misaligned chips during tray unloading.
Technical Parameters
FOV
150mm × 113mm
Pixels Per FOV
2592 × 1944
Repeatability
40 μm
Accuracy
60 μm
Resolution
0.057 mm/pixel