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Lead Scan Semiconductors
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Semicon-Lead Scan

4 Sides Vision Module

Performs simultaneous bilateral dimensional measurement and defect inspection for multiple components in a single shot.
Defect Images

Technical Parameters


  • FOV
    10mm × 80mm
  • Pixels Per FOV
    9344 × 7000
  • Repeatability
    10 μm
  • Accuracy
    10 μm
  • Resolution
    0.01 mm/pixel
  • Minimum Feature Diameter
    20 μm
  • Maximum device size
    80 mm
  • L × W × H
    660mm × 272mm × 780mm
  • Weight
    ≈ 30 kg